We will exhibit at DX Comprehensive EXPO 2026 Autumn Tokyo!

October 19, 2026

We will exhibit at DX Comprehensive EXPO 2026 Autumn Tokyo!

Human Science Co., Ltd. will exhibit at the "2026 DX Comprehensive EXPO Autumn Tokyo."


At our booth,

・"iSpring," which allows easy creation of e-learning materials from PowerPoint

・Video content creation tool "Vyond"

・LMS platforms "Moodle", "Moodle Workplace", "Totara"

・Learning analytics, visualization of educational effectiveness, and AI-powered support for human resource development

Introducing solutions that realize the digitalization of human resource development.

 

Solutions to Realize the Digitalization of Human Resource Development

 

Additionally, we have prepared a demo environment for the latest Moodle LTS version "Moodle 5.3," scheduled for release on October 5, where you can experience the actual interface and new features.

 

This is a valuable opportunity not only for customers currently using Moodle but also for those considering its introduction, to check the usability and key enhancements of the latest version.

"Training materials remain in PowerPoint format"

"Unable to track who has taken the course"

"Want to visualize educational effectiveness and skill improvement"

If you have such challenges, please feel free to consult with us.

We offer one-stop solutions from content creation and LMS implementation to learning data utilization and operational support.

We sincerely look forward to your visit.

Exhibit Overview

Venue: Makuhari Messe Halls 1–3

Event Schedule: November 4 (Wed)–November 6 (Fri), 2026, 10:00 a.m.–5:00 p.m. each day

Registration: Please register in advance at the URL below and obtain your badge. https://www.bizcrew.jp/expo/entry/dx-tokyo

 

Those who make a prior reservation to visit our booth will receive an Amazon gift card worth 1,500 yen. Please be sure to make a reservation in advance and visit us.

Contact Information

For questions and inquiries, please contact us below.

Website https://hs-learning.jp/contact/

Email hsweb_inquiry@science.co.jp